Title:
COMPLEX
Document Type and Number:
WIPO Patent Application WO/2022/209904
Kind Code:
A1
Abstract:
The present invention relates to a complex comprising: an adhesive body having a long shape, said adhesive body excelling in adhesive strength and having good electrical conductivity in the longitudinal direction of the complex and in 360 degrees of a circumferential direction (Y, Z axis directions) with the longitudinal direction as an axis (X axis); and a linear member that is electrically conductive.
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Inventors:
MORISHITA HIROMITSU (JP)
TAKASHIMA ATSUSHI (JP)
TAKASHIMA ATSUSHI (JP)
Application Number:
PCT/JP2022/011974
Publication Date:
October 06, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; C09J7/00; C09J133/06
Domestic Patent References:
| WO2020071508A1 | 2020-04-09 |
Foreign References:
| JP2020024855A | 2020-02-13 | |||
| JPH1186638A | 1999-03-30 | |||
| US20050286843A1 | 2005-12-29 | |||
| US20170131499A1 | 2017-05-11 | |||
| JPS58123504A | 1983-07-22 | |||
| JP2012234640A | 2012-11-29 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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