Title:
COMPONENT MODULE AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2021/117191
Kind Code:
A1
Abstract:
A component module that comprises a flexible first insulating layer 10, an electronic component 20b that is bonded to a lower surface of the first insulating layer, a first metal layer 14 that is provided on an upper surface of the first insulating layer and is connected to the electronic component via a through hole 16 that passes through the first insulating layer, a flexible second insulating layer 30 that is provided on the first insulating layer and has a recess 31 that corresponds to the first metal layer in a lower surface thereof, the first metal layer being positioned inside the recess, and a resin adhesive 32 that is provided between the first insulating layer/the first metal layer and the second insulating layer and bonds the first insulating layer/the first metal layer and the second insulating layer.
Inventors:
TSUDA YUTA (JP)
Application Number:
PCT/JP2019/048714
Publication Date:
June 17, 2021
Filing Date:
December 12, 2019
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01L23/12
Foreign References:
| JPH04233265A | 1992-08-21 | |||
| JP2016213466A | 2016-12-15 | |||
| JPH11163518A | 1999-06-18 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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