COMPONENT MOUNTER AND ELECTRONIC COMPONENT IMAGING METHOD

WIPO Patent Application WO/2022/259338

A1

This component mounter mounts electronic components on a substrate. The component mounter comprises: a substrate transport device that transports a substrate to a work position within the component mounter; a component supply device that supplies electronic components; a nozzle that suctions the electronic components supplied from the component supply device; a component-moving device that is able to move the nozzle between the component supply device and the work position, and that can rotate the nozzle around the axis; an imaging device that is arranged between the component supply device and the substrate transport device, and that images the electronic components suctioned by the nozzle from below; and a control device that, when the electronic components suctioned by the nozzle are of a size that can be arranged over both the entire imaging range of the imaging device and above the substrate transported to the work position, when imaging the electronic components using the imaging device, controls the component-moving device to rotate the nozzle to a position at which the electronic components are not positioned above the substrate, and controls the imaging device to perform imaging of the electronic components from below before and after the nozzle is rotated around the axis.

SHIMIZU SHOTA (JP)

PCT/JP2021/021641

December 15, 2022

June 07, 2021

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FUJI CORP (JP)

H05K13/08; H05K13/04

JPH1013097A	1998-01-16
JP2010021248A	2010-01-28
JP2014099556A	2014-05-29

KAI-U PATENT LAW FIRM (JP)

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