Title:
COMPONENT MOUNTER
Document Type and Number:
WIPO Patent Application WO/2020/165993
Kind Code:
A1
Abstract:
Provided is a component mounter (10) which suction attaches thereto, with a plurality of suction nozzles (26) which are elevatably disposed on mount heads (24), electronic components (30) which are arranged on a plurality of trays (22) which are loaded on a pallet (23) of a tray feeder (20), and which mounts said electronic components (30) on a circuit substrate (12). The mount heads are configured so as to be capable of simultaneously lowering at least two of the plurality of suction nozzles and simultaneously suction attaching thereto at least two of the electronic components. A control device (41), which controls the electronic component suctioning and mounting operation, moves the mount head such that the at least 2 suction nozzles that are simultaneously lowered in the electronic component suction attachment process are positioned so as to straddle at least two trays on the pallet, and simultaneously lowers the at least 2 suction nozzles so as to simultaneously suction attach components from at least 2 trays.
Inventors:
NAKAYAMA YUKINORI (JP)
Application Number:
PCT/JP2019/005273
Publication Date:
August 20, 2020
Filing Date:
February 14, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K13/02
Domestic Patent References:
| WO2013140600A1 | 2013-09-26 |
Foreign References:
| JP2012119548A | 2012-06-21 | |||
| JP2011228327A | 2011-11-10 | |||
| JP2013008729A | 2013-01-10 | |||
| JP2015179709A | 2015-10-08 |
Other References:
See also references of EP 3927135A4
Attorney, Agent or Firm:
KAKO, Muneo (JP)
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