Title:
COMPONENT MOUNTER
Document Type and Number:
WIPO Patent Application WO/2022/137378
Kind Code:
A1
Abstract:
The present invention provides a component mounter including a component supply portion, a palette member, and a mounting head, and a calculation unit. The component supply portion supplies lead components provided with leads. The palette member includes a plurality of slots in which lead cutting devices for cutting the leads are mounted. The mounting head executes mounting processing for collecting and transferring the lead components onto the lead cutting devices and mounting, at predetermined mounting positions on a substrate, the lead components from which the leads are cut away by the lead cutting devices. The calculation unit calculates recommendation information corresponding to information on lead cutting devices to be used for mounting processing, from among the plurality of lead cutting devices mounted on the palette member or at slot positions of slots in which the lead cutting devices are to be mounted, the calculation being executed so as to minimize a moving distance of the lead component on the lead component movement path, including at least the collection position of the lead component, the slot position of the slot in which the lead cutting device is mounted, and a mounting position of the lead component.
Inventors:
CHI XIAODONG (JP)
Application Number:
PCT/JP2020/048109
Publication Date:
June 30, 2022
Filing Date:
December 23, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2019220499A1 | 2019-11-21 | |||
| WO2018092249A1 | 2018-05-24 | |||
| WO2014109035A1 | 2014-07-17 | |||
| WO2019176033A1 | 2019-09-19 |
Foreign References:
| JP2008060543A | 2008-03-13 | |||
| JP2005327998A | 2005-11-24 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
Download PDF: