Title:
COMPONENT MOUNTING APPARATUS CAPABLE OF MOUNTING COMPONENTS AROUND OBSTACLES
Document Type and Number:
WIPO Patent Application WO/2018/230779
Kind Code:
A1
Abstract:
The present invention relates to a component mounting apparatus comprising: a head for mounting a component to be mounted on a mounting point on a substrate; a driving unit for moving the head; and a control unit for generating a head movement path along which the head moves from a supply point of the component to be mounted to the mounting point and controlling the driving unit so as to move the head along the head movement path, wherein when an interfering component is located in the head movement path and the sum of the height of the interfering component and the height of the component to be mounted is greater than or equal to a maximum transport height of the head, the control unit generates a head bypass path along which the interfering component is not located, and controls the driving unit so as to move the head along the head bypass path, such that the component can be mounted on the mounting point without colliding with the interfering component.
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Inventors:
SONG KYUNG SOO (KR)
Application Number:
PCT/KR2017/012333
Publication Date:
December 20, 2018
Filing Date:
November 02, 2017
Export Citation:
Assignee:
HANWHA PREC MACH CO LTD (KR)
International Classes:
H05K13/04
Domestic Patent References:
| WO2015173947A1 | 2015-11-19 |
Foreign References:
| KR20010085492A | 2001-09-07 | |||
| JP2004343029A | 2004-12-02 | |||
| JP2003078300A | 2003-03-14 | |||
| US20070074390A1 | 2007-04-05 |
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
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