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Title:
COMPONENT MOUNTING DEVICE AND EVALUATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/026564
Kind Code:
A1
Abstract:
A component mounting device (10) mounts a component to a substrate (1), and comprises: a suction nozzle (24) that has a suction surface (26) for suctioning the component; an imaging unit (32) that images the suction surface (26); and an evaluation unit (42) that evaluates a wear condition of the suction surface (26) on the basis of an image imaged by the imaging unit (32).

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Inventors:
MAWATARI MICHIAKI
Application Number:
PCT/JP2022/014866
Publication Date:
March 02, 2023
Filing Date:
March 28, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/08
Foreign References:
JP2004071975A2004-03-04
JPH0722783A1995-01-24
JPH1013093A1998-01-16
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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