Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/105138
Kind Code:
A1
Abstract:
This component mounting device is provided with a substrate height sensor which is provided so as to be horizontally movable by a horizontal movement device and which measures the height of a substrate surface. The component mounting device causes the substrate height sensor to horizontally move to a plurality of measurement points and causes the sensor to measure the height of the substrate surface at each of the plurality of measurement points. Subsequently, the component mounting device calculates horizontal positional displacement of a target mounting position on the substrate surface on the basis of the measured height of the substrate surface. Furthermore, the component mounting device calculates vertical positional displacement of the target mounting position on the basis of the measured height, in the vertical direction, of the substrate surface. In addition, the component mounting device revises the target mounting position on the basis of the calculated horizontal positional displacement and vertical positional displacement, and mounts a component to the revised position.
Inventors:
OTSUKI TAKAHIRO (JP)
SHIMIZU TOSHINORI (JP)
SHIMIZU TOSHINORI (JP)
Application Number:
PCT/JP2018/042983
Publication Date:
May 28, 2020
Filing Date:
November 21, 2018
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2015056785A1 | 2015-04-23 |
Foreign References:
| JP2017152454A | 2017-08-31 | |||
| JPH0448698A | 1992-02-18 | |||
| JP2014003153A | 2014-01-09 | |||
| JP2010186940A | 2010-08-26 | |||
| JP2014003153A | 2014-01-09 |
Other References:
See also references of EP 3886552A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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