Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/073776
Kind Code:
A1
Abstract:
This component mounting device is provided with: a suction nozzle which performs a suctioning operation in which negative pressure air is supplied and a component is suctioned, and which performs a mounting operation in which the negative pressure air is cut off and the component is mounted on a board; a first negative pressure supply unit which can supply negative pressure air to the suction nozzle during the time period from when the suction nozzle starts the suctioning operation until the suction nozzle starts the mounting operation; a second negative pressure supply unit which can supply negative pressure air to the suction nozzle; a negative pressure detection unit which directly or indirectly detects the pressure value of the negative pressure air supplied to the suction nozzle; and a negative pressure supply control unit which actuates the second negative pressure supply unit in the case that the detected pressure value of the negative pressure air is closer to the atmospheric pressure value than a prescribed value set between the atmospheric pressure value and a vacuum value.
Inventors:
TESHIMA CHIKASHI (JP)
MIZUNO TAKAYUKI (JP)
MIZUNO TAKAYUKI (JP)
Application Number:
PCT/JP2021/039344
Publication Date:
May 04, 2023
Filing Date:
October 25, 2021
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2017126031A1 | 2017-07-27 |
Foreign References:
| JPH08130235A | 1996-05-21 | |||
| JP2021019137A | 2021-02-15 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
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