Title:
COMPONENT MOUNTING INSPECTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/011753
Kind Code:
A1
Abstract:
A component mounting inspection apparatus (18) inspects mounting states of electronic components (60, 70) prior to reflowing first and second solder (54, 58) after mounting first and second electronic components (60, 70) on the solder printed on first and second electrode pads (52, 56) of a substrate (50). Specifically, the component mounting inspection apparatus (18) acquires positional information of the first and second electrode pads (52, 56), positional information of the first and second solder (54, 58), and positional information of terminals of the first and second electronic components (60, 70). Then, on the basis of the positional information, the component mounting inspection apparatus (18) predicts whether positions of the first and second electronic components (60, 70) with respect to the first and second electrode pads (52, 56) after the solder reflowing step are within a predetermined correct range.
Inventors:
OTA FUMIO (JP)
OHASHI TERUYUKI (JP)
OHASHI TERUYUKI (JP)
Application Number:
PCT/JP2013/069764
Publication Date:
January 29, 2015
Filing Date:
July 22, 2013
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
G01B11/00; B23K1/00; G01N21/956; H05K3/34; H05K13/08
Foreign References:
| JP2008072034A | 2008-03-27 | |||
| JP2005045113A | 2005-02-17 | |||
| JP2007036059A | 2007-02-08 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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