Title:
COMPONENT-MOUNTING MACHINE AND COMPONENT-MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/130443
Kind Code:
A1
Abstract:
This component-mounting machine for executing a mounting operation for mounting a component on a substrate comprises: a suction tool for sucking the component at a suction height separated by a distance indicated by an offset amount from a reference height; a moving mechanism for moving the suction tool to the suction height; a trial unit that performs the mounting operation a prescribed number of times; a first calculation unit that calculates a suction rate indicating the success rate of component suction by the suction tool during the mounting operation performed the prescribed number of times; and an update unit that, when the suction rate is lower than a determined value, updates the offset amount within a prescribed range by adding or subtracting a prescribed distance to or from the offset amount, and further repeats the trial unit and the first calculation unit.
Inventors:
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2020/046496
Publication Date:
June 23, 2022
Filing Date:
December 14, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Foreign References:
| JPH0983198A | 1997-03-28 | |||
| JP6076047B2 | 2017-02-08 | |||
| JPH11154797A | 1999-06-08 | |||
| JPH0637486A | 1994-02-10 | |||
| JP2007043076A | 2007-02-15 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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