Title:
COMPONENT MOUNTING MACHINE AND SUBSTRATE PRODUCTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/091378
Kind Code:
A1
Abstract:
A component mounting machine comprising: a measuring unit for measuring the flatness of a lead electrode portion of a component to be mounted to a substrate; an allowed component determining unit for determining a component of which the flatness measured by the measuring unit is within a first allowable range, as an allowed component allowed to be mounted to the substrate; a discarded component determining unit for determining a component of which the flatness measured by the measuring unit is outside a second allowable range which is outside the first allowable range, as a discarded component prohibited from being mounted to the substrate; and a recovery processing unit for recovering a component of which the flatness measured by the measuring unit is outside the first allowable range and within the second allowable range, as a mountable component that can be mounted to the substrate.
Inventors:
KATO NAOHIRO (JP)
Application Number:
PCT/JP2020/040933
Publication Date:
May 05, 2022
Filing Date:
October 30, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Foreign References:
| JP2019021697A | 2019-02-07 | |||
| JPS62295482A | 1987-12-22 | |||
| JPH0284000A | 1990-03-26 | |||
| JP2013143419A | 2013-07-22 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
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