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Patent Searching and Data


Title:
COMPONENT MOUNTING MACHINE, COMPONENT SUCTIONING METHOD, NOZZLE DISPOSING METHOD, AND METHOD FOR DISPOSING COMPONENT SUPPLYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/138911
Kind Code:
A1
Abstract:
This component mounting machine is provided with a plurality of component supplying devices, a head, a head moving device, and a nozzle lifting device. The component supplying devices each feed a component to a component supplying position. The head has a plurality of nozzles which suction components. The head moving device can move the head and thereby allow the nozzles to face respective two or more component supplying positions. The nozzle lifting device moves the nozzles up and down while the nozzles face the component supplying positions. In this component mounting machine, when the nozzles are positioned to face the two or more respective component supplying positions, the head is moved so that the positional correction of the nozzle facing the smallest one of the components supplied to the two or more component supplying positions is prioritized, and in this state, the nozzles facing the respective two or more component supplying positions are moved up and down concurrently, whereby the components are suctioned onto respective nozzles.

Inventors:
KAWAI HIDETOSHI (JP)
IISAKA JUN (JP)
ITO HIDETOSHI (JP)
Application Number:
PCT/JP2017/003173
Publication Date:
August 02, 2018
Filing Date:
January 30, 2017
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Foreign References:
JPH06278061A1994-10-04
JP2002026592A2002-01-25
JPH10107490A1998-04-24
JP2003258495A2003-09-12
JP2013098289A2013-05-20
JP2003174286A2003-06-20
Other References:
See also references of EP 3576513A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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