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Patent Searching and Data


Title:
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/166179
Kind Code:
A1
Abstract:
In the present invention, a component mounting machine comprises: an imaging device capable of imaging, from above, a feed position at which a component is fed from a component feeding device; a component sensor capable of sensing the component; and a control device. When a prescribed assessment condition is met, the control device acquires component information relating to the component fed by the component feeding device. The control device selects, on the basis of the component information, and performs, one of a plurality of processes including: a first assessment process for assessing the presence/absence of a component at the feed position on the basis of a captured image obtained by imaging the feed position via the imaging device, and thereby assessing the presence/absence of a component shortage in the component feeding device; and a second assessment process for assessing the presence/absence of a component at the feed position via the component sensor, and thereby assessing the presence/absence of a component shortage in the component feeding device.

Inventors:
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2020/006872
Publication Date:
August 26, 2021
Filing Date:
February 20, 2020
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02
Domestic Patent References:
WO2017022098A12017-02-09
Foreign References:
JP6043994B22016-12-14
JP6103800B22017-03-29
JPH08274500A1996-10-18
JP2937785B21999-08-23
JP2017011316A2017-01-12
Other References:
See also references of EP 4110030A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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