Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPONENT MOUNTING MACHINE AND COMPONENT MOUNTING TOOL
Document Type and Number:
WIPO Patent Application WO/2023/238380
Kind Code:
A1
Abstract:
This component mounting machine comprises: a component mounting tool for picking up a component by supplying negative-pressure air and attaching the component onto a board; an attachment head which has a main holding mechanism for holding the component mounting tool in an attachable/detachable manner with a predetermined holding force, and is capable of moving in the horizontal direction; and an auxiliary holding mechanism which operates by means of the supply of the negative pressure air and generates an auxiliary holding force that is added to the holding force.

More Like This:
JP2769358[Title of Invention] Printed circuit board assembly system
JP5570259A planning-of-production deciding method in a production line system
JPS58105199[Title of the device] An adsorption device of electronic parts
Inventors:
OKA HIROMITSU (JP)
Application Number:
PCT/JP2022/023449
Publication Date:
December 14, 2023
Filing Date:
June 10, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
WO2017203626A12017-11-30
Foreign References:
JPH10335897A1998-12-18
JP2011243673A2011-12-01
JP2014034103A2014-02-24
JP2017199835A2017-11-02
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: LITHIUM SECONDARY BATTERY AND METHOD FOR PRODUCING LITHIUM SECONDARY BATTERY

Next Patent: MOTOR CONTROL DEVICE AND MOTOR CONTROL SYSTEM