Title:
COMPONENT MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/209902
Kind Code:
A1
Abstract:
A component mounting substrate (10) on which an electronic component (12) is mounted comprises: a wiring layer (10) provided with a copper pad (10p) at a position corresponding to an electrode terminal (12B, 12C) of the electronic component (12); a surface pad (13) formed in a part of a surface of the copper pad (10p) and made of a surface treated material for soldering; and a solder (14) which connects the electrode terminal (12B, 12C) to the surface pad (13), wherein the solder (14) extends from the surface pad (13) to the copper pad (10p).
Inventors:
TODA MITSUAKI (JP)
IWAMOTO MITSUO (JP)
IWAMOTO MITSUO (JP)
Application Number:
PCT/JP2022/019180
Publication Date:
November 02, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K3/46; H05K3/34
Domestic Patent References:
| WO2011135670A1 | 2011-11-03 |
Foreign References:
| JP2013004843A | 2013-01-07 |
Attorney, Agent or Firm:
NAGATO, Kanji (JP)
Download PDF: