Title:
COMPONENT MOUNTING SYSTEM AND METHOD FOR SUPPLYING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/044148
Kind Code:
A1
Abstract:
This component mounting system comprises: a tape-type component supply feeder that has a component delivery mechanism, which is detachably attached to a component mounting machine for mounting electronic components to a board and delivers, to a supply position, an electronic component accommodated in a tape, and that supplies, to the component mounting machine, the electronic component delivered to the supply position; a storage unit that stores shape data on the electronic component; and a control unit that determines, on the basis of the shape data on the electronic component, the speed of the component delivery mechanism while the electronic component is delivered to the supply position and is then stopped.
Inventors:
SAKURAYAMA TAKESHI (JP)
Application Number:
PCT/JP2020/032116
Publication Date:
March 03, 2022
Filing Date:
August 26, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02
Domestic Patent References:
| WO2018150578A1 | 2018-08-23 | |||
| WO2013153731A1 | 2013-10-17 |
Foreign References:
| JP2014204058A | 2014-10-27 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
Download PDF:
Previous Patent: AERIAL VEHICLE, CONTROL METHOD, AND CONTROL DEVICE
Next Patent: REFRIGERATION CYCLE DEVICE
Next Patent: REFRIGERATION CYCLE DEVICE