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Title:
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/007740
Kind Code:
A1
Abstract:
A component mounting system (100) includes a component mounting device (13), a transfer robot (40) that collects and transfers component supply units (60) from the component mounting device, a return device (30) to which the component supply units are returned, and a control device (50) that controls the transfer robot so that component supply units requiring maintenance and component supply units not requiring maintenance among component supply units to be collected can be simultaneously collected and returned to the return device in such a manner that the component supply units requiring maintenance and the component supply units not requiring maintenance are distinguishable from each other.

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JP2005511426Electronic component packaging method and equipment, and electronic components packaged by the same method
Inventors:
OKAMURA NAOTO (JP)
FUJIMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/028477
Publication Date:
February 02, 2023
Filing Date:
July 30, 2021
Export Citation:
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Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/00
Domestic Patent References:
WO2020090006A12020-05-07
WO2018127956A12018-07-12
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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