Title:
COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/001996
Kind Code:
A1
Abstract:
This component mounting system is provided with a plurality of component mounting machines which are arranged in the conveying direction of a substrate and respectively have image capturing devices which capture images of the substrate. Furthermore, the component mounting system is provided with a learning device, and an inspection device. The learning device captures, by means of an image capturing device, images of a component-to-be mounted substrate and a component-mounted substrate, generates learning data of the component-to-be mounted substrate through machine learning on the basis of the captured image of the component-to-be mounted substrate, acquires teacher data based on the captured image of the component-mounted substrate, and generates learning data of the component-mounted substrate through machine learning on the basis of the teacher data and the captured image of the component-mounted substrate. The inspection device captures, by means of the image capturing device, an image of the component-mounted substrate, and performs inspection for the component-mounted substrate by performing image processing for recognizing the component in the captured image of the component-mounted substrate by using the learning data of the component-to-be mounted substrate and the component-mounted substrate.
Inventors:
INAGAKI MITSUTAKA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
Application Number:
PCT/JP2019/026655
Publication Date:
January 07, 2021
Filing Date:
July 04, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00; H05K13/08
Foreign References:
JP2018025481A | 2018-02-15 | |||
JP2011145958A | 2011-07-28 | |||
JP2017033979A | 2017-02-09 | |||
JP2018097731A | 2018-06-21 | |||
JPH1041700A | 1998-02-13 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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