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Patent Searching and Data


Title:
COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/001996
Kind Code:
A1
Abstract:
This component mounting system is provided with a plurality of component mounting machines which are arranged in the conveying direction of a substrate and respectively have image capturing devices which capture images of the substrate. Furthermore, the component mounting system is provided with a learning device, and an inspection device. The learning device captures, by means of an image capturing device, images of a component-to-be mounted substrate and a component-mounted substrate, generates learning data of the component-to-be mounted substrate through machine learning on the basis of the captured image of the component-to-be mounted substrate, acquires teacher data based on the captured image of the component-mounted substrate, and generates learning data of the component-mounted substrate through machine learning on the basis of the teacher data and the captured image of the component-mounted substrate. The inspection device captures, by means of the image capturing device, an image of the component-mounted substrate, and performs inspection for the component-mounted substrate by performing image processing for recognizing the component in the captured image of the component-mounted substrate by using the learning data of the component-to-be mounted substrate and the component-mounted substrate.

Inventors:
INAGAKI MITSUTAKA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
Application Number:
PCT/JP2019/026655
Publication Date:
January 07, 2021
Filing Date:
July 04, 2019
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00; H05K13/08
Foreign References:
JP2018025481A2018-02-15
JP2011145958A2011-07-28
JP2017033979A2017-02-09
JP2018097731A2018-06-21
JPH1041700A1998-02-13
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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