Title:
COMPONENT SETUP ASSISTANCE DEVICE, SOLDER SETUP ASSISTANCE DEVICE, COMPONENT SETUP ASSISTANCE METHOD, SOLDER SETUP ASSISTANCE METHOD, COMPONENT SETUP ASSISTANCE PROGRAM, SOLDER SETUP ASSISTANCE PROGRAM, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2023/203666
Kind Code:
A1
Abstract:
In step S103, it is checked whether the type K of a component E to be mounted on a component mounter 4 of a substrate production line 10A, i.e., a component type Kp to be picked up, exists in a component type Ku in use. On the basis of the results of the component checking in step S103 (step S104), in steps S108 to S110, it is determined (mounting work determination) whether the component E is to be mounted on the substrate production line 10A by delivery mounting work or diversion mounting work. Therefore, depending on the mounting situation of the component E of the component type Kp to be picked up on the other substrate production line 10B or 10C, the component E of the component type Kp to be picked up can be transferred from the substrate production line 10B or 10C to the substrate production line 10A and used for the production of a component mounting substrate B on the substrate production line 10A.
Inventors:
OKUMURA YOSHIKI (JP)
Application Number:
PCT/JP2022/018256
Publication Date:
October 26, 2023
Filing Date:
April 20, 2022
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/00; H05K3/34
Domestic Patent References:
| WO2020039495A1 | 2020-02-27 |
Foreign References:
| JP2008217114A | 2008-09-18 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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