Title:
COMPOSITE COPPER FOIL AND METHOD FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2006/013735
Kind Code:
A1
Abstract:
A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molybdenum and the other surface thereof comprises, as a main component, a metal oxide containing tungsten or a metal oxide containing molybdenum. The composite copper foil is free from undesired swelling, separation or falling of the supporting metal layer during heating and working at a high temperature, and the supporting metal layer can be exfoliated from the thin copper layer with ease, after the heating and the working.
Inventors:
SATO YUUSHI (JP)
Application Number:
PCT/JP2005/013466
Publication Date:
February 09, 2006
Filing Date:
July 22, 2005
Export Citation:
Assignee:
NIPPON DENKAI LTD (JP)
SATO YUUSHI (JP)
SATO YUUSHI (JP)
International Classes:
B32B15/01; C25D7/06; C23C28/00; C25D9/08; H05K1/09
Domestic Patent References:
| WO2002024444A1 | 2002-03-28 |
Foreign References:
| JP2003286596A | 2003-10-10 | |||
| JP2003094553A | 2003-04-03 | |||
| JP2001301087A | 2001-10-30 | |||
| JP2004169181A | 2004-06-17 |
Attorney, Agent or Firm:
Hotaka, Tetsuo (Tsukiji Chuo-k, Tokyo 45, JP)
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