Title:
COMPOSITE COPPER FOIL STRUCTURE, PREPARATION METHOD THEREFOR, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/029908
Kind Code:
A1
Abstract:
The present application discloses a composite copper foil structure, a preparation method therefor, a copper clad laminate, and a printed circuit board. The composite copper foil structure comprises a copper foil core layer and a shell layer. The copper foil core layer has a first surface and a second surface. The shell layer is located on at least the first surface and the second surface of the copper foil core layer. The shell layer comprises a number N of layers of graphene and a number M of layers of metallic copper. The graphene layers and the metallic copper layers are alternately laminated. A surface of the shell layer close to the copper foil core layer is a graphene layer. A thickness of the copper foil core layer is greater than a thickness of a metallic copper layer in the shell layer. The composite copper foil structure is formed from alternating metallic copper layers and graphene layers. The composite effect of graphene and copper is used to increase the surface electrical conductivity of the composite copper foil structure, thereby providing a composite copper foil structure having high electrical conductivity. Furthermore, since the shell layer composed of graphene layers and metallic copper layers is only disposed on the surface of the core layer, and the core layer still uses copper foil, the cost is relatively low.
Inventors:
ZHANG QIYAN (CN)
CAI LI (CN)
GAO FENG (CN)
CAI LI (CN)
GAO FENG (CN)
Application Number:
PCT/CN2022/111262
Publication Date:
March 09, 2023
Filing Date:
August 09, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/09; B32B9/00; B32B9/04; B32B15/20; B32B37/00; C23C14/18; C23C14/58; C23C16/26; C23C28/00; C25D3/38; C25D5/50; C25D5/54
Foreign References:
| CN113873750A | 2021-12-31 | |||
| CN111069611A | 2020-04-28 | |||
| CN106584976A | 2017-04-26 | |||
| US20180102197A1 | 2018-04-12 | |||
| CN111145960A | 2020-05-12 |
Other References:
FAN YIN, XIANG YANG, SHEN HUI-SHEN: "Temperature-Dependent Mechanical Properties of Graphene/Cu Nanocomposites with In-Plane Negative Poisson’s Ratios", RESEARCH, vol. 2020, 1 January 2020 (2020-01-01), XP093042481, DOI: 10.34133/2020/5618021
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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