Title:
COMPOSITE ELECTROCONDUCTIVE PARTICLES, AND METHOD FOR PRODUCING COMPOSITE ELECTROCONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2022/024737
Kind Code:
A1
Abstract:
Provided are: composite electroconductive particles which suppress cracking and peeling of a metal film and by which excellent metal-film adhesive properties can be obtained; and a method for producing the composite electroconductive particles. The composite electroconductive particles each comprise: a base particle (11); adhesive particulates (12) which are arranged on the surface of the base particle (11) and which contain oxygen atoms; and electroconductive particulates (13) which are in contact with the adhesive particulates (12). Excellent metal-film adhesive properties can be obtained as a result of the structure in which the adhesive particulates (12) including the oxygen atoms are arranged on the surface of the base particle (11) and the electroconductive particulates (13) are in contact with the adhesive particles (12).
Inventors:
NAMIKI HIDETSUGU (JP)
WAKU KAORI (JP)
NISHIO TAKESHI (JP)
TANAKA YUSUKE (JP)
KUGA SHOKO (JP)
WAKU KAORI (JP)
NISHIO TAKESHI (JP)
TANAKA YUSUKE (JP)
KUGA SHOKO (JP)
Application Number:
PCT/JP2021/026175
Publication Date:
February 03, 2022
Filing Date:
July 12, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01B5/00
Foreign References:
| JPH0394078A | 1991-04-18 | |||
| JP2002231052A | 2002-08-16 | |||
| JP2018049939A | 2018-03-29 | |||
| JP2004179137A | 2004-06-24 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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