Title:
COMPOSITE FILM OF POLYIMIDE-BASED RESIN MICROPARTICLES AND USAGE THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/133143
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a new product and new technology capable of forming a composite film of polyimide-based resin microparticles that is homogeneous and has excellent adhesiveness and smoothness. The present invention relates to a composite film of polyimide-based resin microparticles produced by using a dispersing liquid (A) of a cellulosic dispersion agent added to a water dispersion of polyimide-based resin microparticles having particle diameters equal to or less than 2.5 μm, which is then spread and dried. The present invention also relates to a composite film of polyimide-based resin microparticles produced by, after drying and powdering the dispersing liquid (A) of a cellulosic dispersion agent added to a water dispersion of polyimide-based resin microparticles having particle diameters equal to or less than 2.5 μm, using a dispersing liquid (B) re-dispersed with water, which is then spread and dried.
Inventors:
MAEDA TAKAHIRO (JP)
ONISHI HITOSHI (JP)
ONISHI HITOSHI (JP)
Application Number:
PCT/JP2012/057442
Publication Date:
October 04, 2012
Filing Date:
March 23, 2012
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
MAEDA TAKAHIRO (JP)
ONISHI HITOSHI (JP)
MAEDA TAKAHIRO (JP)
ONISHI HITOSHI (JP)
International Classes:
B32B27/34; C08L1/00; C08L79/08
Foreign References:
| JP2010225539A | 2010-10-07 | |||
| JP2008084832A | 2008-04-10 | |||
| JP2011049046A | 2011-03-10 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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