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Patent Searching and Data


Title:
COMPOSITE MATERIAL COMPIRISING PHENOLIC RESIN AND METHOD OF PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/134972
Kind Code:
A1
Abstract:
It is intended to provide a method of producing a composite material comprising a phenolic resin, which contains a filler uniformly dispersed in the phenolic resin and has a favorable performance and high functional properties, at a low cost. Namely, a composite material comprising a phenolic resin characterized in that a filler is uniformly dispersed in the resin by pouring the phenolic resin material into a reactor together with the filler and then conducting the polymerization of the resin by stirring under heating to thereby disperse the filler in the resin in the course of the polymerization. A composite material comprising a phenolic resin characterized by being obtained by pouring the phenolic resin material into a reactor together with the filler, then conducting the polymerization of the resin by stirring under heating to thereby disperse the filler in the resin in the course of the polymerization, cooling the viscous liquid having the filler uniformly dispersed in the resin and then grinding; and a method of producing the same.

Inventors:
KURIHARA SHOU
IDEI HIROSHI
AMANO MAMORU
AOYAGI YOSHIHIRO
Application Number:
PCT/JP2006/311935
Publication Date:
December 21, 2006
Filing Date:
June 14, 2006
Export Citation:
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Assignee:
AKEBONO BRAKE IND (JP)
KURIHARA SHOU
IDEI HIROSHI
AMANO MAMORU
AOYAGI YOSHIHIRO
International Classes:
C08G8/00
Foreign References:
JP2003342443A2003-12-03
Attorney, Agent or Firm:
Oguri, Shohei (7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, JP)
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