COMPOSITE MEMBER - SUMITOMO ELECTRIC INDUSTRIES

Title:

COMPOSITE MEMBER

Document Type and Number:

WIPO Patent Application WO/2010/038483

Kind Code:

A1

Abstract:

Disclosed is a composite member suitable as a heat-dissipating member for a semiconductor element. Also disclosed is a process for producing the composite member. The composite member is a complex of magnesium or a magnesium alloy and SiC and has a void ratio of less than 3%. The composite member is produced by forming an oxide film on the surface of a raw material SiC, placing the coated SiC having the oxide film formed thereon in a template, and infiltrating a molten metal (magnesium or a magnesium alloy) into the coated SiC aggregate. The wettability of SiC with the molten metal can be increased by forming the oxide film, whereby the void ratio of the composite member can be reduced. The process enables the production of a composite member having excellent thermal properties including a thermal expansion coefficient of 4 to 10 ppm/K inclusive and a heat conductivity of 180 W/m·K or more.

Inventors:

IWAYAMA ISAO (JP)
NAKAI YOSHIHIRO (JP)
NISHIKAWA TAICHIRO (JP)
TAKAKI YOSHIYUKI (JP)
KUSAKARI MISATO (JP)
IKEDA TOSHIYA (JP)

Application Number:

PCT/JP2009/005132

Publication Date:

April 08, 2010

Filing Date:

October 02, 2009

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)
IWAYAMA ISAO (JP)
NAKAI YOSHIHIRO (JP)
NISHIKAWA TAICHIRO (JP)
TAKAKI YOSHIYUKI (JP)
KUSAKARI MISATO (JP)
IKEDA TOSHIYA (JP)

International Classes:

B22D19/00; C22C1/10; C22C29/02; C22C32/00

Foreign References:

JP2006299304A	2006-11-02
JP2003183748A	2003-07-03
JP2001181066A	2001-07-03
JPH11277217A	1999-10-12
JP2007247058A	2007-09-27
JP2006299304A	2006-11-02

Other References: