COMPOSITE MEMBER

WIPO Patent Application WO/2011/048972

A1

Disclosed is a composite member which is obtained by bonding a metal component with a thermoplastic polyurethane component using a bonding adhesive that contains a bisphenol A epoxy resin and a silane coupling agent. It is preferable that an adhesive containing a phenol resin and an epoxy resin is applied to the components as a base adhesive before the application of the bonding adhesive. A component obtained by subjecting a thermoplastic polyurethane component, which is obtained by having (A) a high molecular weight polycarbonate diol that has a number average molecular weight (Mn) of 500-6,000, (B) an aromatic diisocyanate and (C) a low molecular weight diol serving as a chain extender react with each other at an NCO/OH ratio of 0.95-1.20, to a heat treatment under the conditions such that the resulting has a hard phase glass transition point (Tg) as determined by differential scanning calorimetry of not less than 170°C, preferably of 170-230°C and an endothermic peak area (∆H) of Tg of not less than 5 J/g is preferably used as the thermoplastic polyurethane component for the composite member.

AJIKI KENICHI (JP)
TABUCHI YUHEI (JP)
ABE KATSUMI (JP)

PCT/JP2010/067844

April 28, 2011

October 12, 2010

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NOK CORP (JP)
AJIKI KENICHI (JP)
TABUCHI YUHEI (JP)
ABE KATSUMI (JP)

B32B15/095; B29C45/14; B32B15/08; C09J163/00; F16J15/18

WO2007066630A1	2007-06-14
WO2008023568A1	2008-02-28

JP2001355739A	2001-12-26
JPH10298527A	1998-11-10
JP2001260233A	2001-09-25
JP2001260235A	2001-09-25
JPS63189489A	1988-08-05
JP2004059796A	2004-02-26

YOSHIDA Toshio et al. (JP)
Toshio Yoshida (JP)

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