Title:
COMPOSITE METAL FOIL AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/104995
Kind Code:
A1
Abstract:
A composite metal foil and a circuit board. The composite metal foil comprises a dielectric layer (110), a first resistance layer (120) and a first conductive layer (130), wherein the first resistance layer (120) is arranged on one side of the dielectric layer (110); at least part of an area on the side of the dielectric layer (110) close to the first resistance layer (120) is configured with a first protruding structure (111), so that second protruding structures (121) are respectively formed in at least part of an area on the side of the first resistance layer (120) close to the dielectric layer (110) and in at least part of an area on the side of the first resistance layer away from the dielectric layer (110); and the first conductive layer (130) is arranged on the side of the first resistance layer (120) away from the dielectric layer (110).
Inventors:
SU ZHI (CN)
Application Number:
PCT/CN2020/137920
Publication Date:
May 27, 2022
Filing Date:
December 21, 2020
Export Citation:
Assignee:
GUANGZHOU FANGBANG ELECTRONICS CO LTD (CN)
International Classes:
H05K1/16; B32B15/08; H05K1/09
Foreign References:
| JP2003200523A | 2003-07-15 | |||
| JP2003193290A | 2003-07-09 | |||
| JPH1051098A | 1998-02-20 | |||
| JP2004315843A | 2004-11-11 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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