Title:
COMPOSITE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/157548
Kind Code:
A1
Abstract:
A composite molded article in which thermoplastic resin foam particles are bonded via a thermosetting resin binder, wherein the density of the composite molded article is 0.05-0.5 g/cm3, and the volume expansion coefficient of the composite molded article when heated for 20 minutes at 100°C is 15-200%.
Inventors:
SASAKI HIDEHIRO (JP)
MORITA TOSHIO (JP)
MORITA TOSHIO (JP)
Application Number:
PCT/JP2021/003653
Publication Date:
August 12, 2021
Filing Date:
February 02, 2021
Export Citation:
Assignee:
JSP CORP (JP)
International Classes:
C08J9/35; B32B5/18; C08K7/02; C08L101/00
Domestic Patent References:
| WO2012086305A1 | 2012-06-28 |
Foreign References:
| JP2019181749A | 2019-10-24 | |||
| JP2019085517A | 2019-06-06 | |||
| JP2017043011A | 2017-03-02 | |||
| JPH08108441A | 1996-04-30 | |||
| JP2012025869A | 2012-02-09 | |||
| JPS531313B1 | 1978-01-18 |
Other References:
See also references of EP 4101879A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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