Title:
COMPOSITE MOLDED PRODUCT HAVING THREE-DIMENSIONAL MULTI-LAYERED CONDUCTIVE CIRCUITS AND METHOD OF ITS MANUFACTURE
Document Type and Number:
WIPO Patent Application WO/1994/005141
Kind Code:
A1
Abstract:
A multi-layered circuit component is efficiently manufactured with a three-dimensional complicated and various circuit group which are incorporated in it exactly and compactly. A primary molded product (wiring board) is formed of a thermo-plastic resin or thermo-setting resin. On one or both sides of the primary molded product, desired conductive circuits are formed, and one or more places of this primary molded product on which the circuits are formed are fixed to a secondary molding die. A thermo-plastic secondary molding material is injection-molded into a composite molded product incorporating all or part of the circuits of the primary molded product. The composite molded product has the circuits in multilayers. Further, at or after the first and second moldings, the through holes are made in given positions of the circuits on the layers. Metal is coated on the inner surface of each through hole in order to form the conductive part in each given position of the circuits.
Inventors:
MIYASHITA TAKAYUKI
Application Number:
PCT/JP1993/001168
Publication Date:
March 03, 1994
Filing Date:
August 20, 1993
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
B29D99/00; B29C69/00; H05K3/00; H05K3/46; B29L31/34; H05K1/18; H05K3/42; (IPC1-7): H05K3/46
Foreign References:
| JPS61252687A | 1986-11-10 | |||
| JPS61289698A | 1986-12-19 | |||
| JPS6334996A | 1988-02-15 | |||
| JPH0378291A | 1991-04-03 | |||
| JPH0435085A | 1992-02-05 | |||
| JPH04332193A | 1992-11-19 |
Other References:
See also references of EP 0614328A4
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