COMPOSITE MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Title:

COMPOSITE MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2006/043474

Kind Code:

A1

Abstract:

Conventionally, since a resin insulating layer with via holes is laminated on an IC chip fixed in a through hole in a ceramic core substrate with a filler like a wiring substrate disclosed in patent document 1, the self-alignment function on an IC chip cannot be used when the IC chip is mounted. Therefore, the via holes (electrodes) in the resin insulating layer is hard to arrange with respect to the terminals of the IC chip and electrical connection between the IC chip and the electrodes of the resin insulating layer is difficult. A composite multilayer substrate (10) of the invention has a laminate structure of a resin part (11) and a ceramic multilayer substrate (12). In the laminate structure, a cavity (10A) is provided. The resin part (11) has a protruding portion (11B), and the ceramic multilayer substrate (12) has a through hole (12B). The cavity (10A) is formed by fitting the protruding portion (11B) of the resin layer (11) into the end portion of the through hole (12B) of the ceramic multilayer substrate (12).

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Inventors:

OGAWA NOBUAKI (JP)
NISHIZAWA YOSHIHIKO (JP)

Application Number:

PCT/JP2005/018937

Publication Date:

April 27, 2006

Filing Date:

October 14, 2005

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
OGAWA NOBUAKI (JP)
NISHIZAWA YOSHIHIKO (JP)

International Classes:

H05K3/46; H01L23/12

Foreign References:

JPH11317473A	1999-11-16
JPH11260964A	1999-09-24
JP2003304065A	2003-10-24

Other References: