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Patent Searching and Data


Title:
COMPOSITE PARTICLES FOR POLISHING, METHOD FOR PRODUCING COMPOSITE PARTICLES FOR POLISHING, AND SLURRY FOR POLISHING
Document Type and Number:
WIPO Patent Application WO/2016/129476
Kind Code:
A1
Abstract:
To provide composite particles for polishing, which have high polishing rate and are obtained by having silica particles support a metal oxide, and which enables the achievement of a smooth polished surface. Composite particles for polishing, which are characterized by being composed of composite silica particles that are obtained by having the surfaces of silica particles support a metal oxide, and which are also characterized in that the half width of the maximum peak in an X-ray diffraction of the metal oxide in a powder X-ray diffraction measurement using a Cu-Kα ray source is from 0.45° to 1.0°.

Inventors:
KAWASAKI YUJI (JP)
YAMAMOTO TSUTOMU (JP)
WADA MIZUHO (JP)
Application Number:
PCT/JP2016/053215
Publication Date:
August 18, 2016
Filing Date:
February 03, 2016
Export Citation:
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Assignee:
SAKAI CHEMICAL INDUSTRY CO (JP)
International Classes:
C01B33/18; B24B37/00; C09K3/14; H01L21/304
Foreign References:
JP2010222151A2010-10-07
JP2012111869A2012-06-14
JP2014130957A2014-07-10
JP2010016063A2010-01-21
JPH10158007A1998-06-16
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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