Title:
COMPOSITE PASTE FOR POWER DEVICE PACKAGING AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/103820
Kind Code:
A1
Abstract:
A composite paste for power device packaging and a preparation method therefor. The present invention relates to the field of power device packaging materials. The present invention aims to solve the technical problems of high costs and poor electromigration resistance of existing silver sintering pastes. The composite paste for power device packaging of the present invention is prepared from a silver-copper filler and an organic carrier, the silver-copper filler being a mixture of flaky silver and spherical copper. The method of the present invention comprises: step 1, stirring a silver-copper filler and an organic carrier until the silver-copper filler and the organic carrier are uniformly mixed to obtain a mixed paste; and step 2, performing three-stage dispersing grinding on the mixed paste to obtain the composite paste for power device packaging. According to the present invention, the objectives of reducing costs while improving the electromigration resistance of the composite paste are achieved by designing the shape compounding of silver and copper; and the present invention is simple in preparation process, the obtained composite paste is low in cost, good in thermal conductivity, unobvious in electromigration failure, and excellent in mechanical property, and the reliability of power device packaging is remarkably improved.
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Inventors:
LIU YANG (CN)
LI KE (CN)
XIAO NAN (CN)
LIU SUSHI (CN)
XU YONGZHE (CN)
MA CHIYUAN (CN)
LI SHIZHEN (CN)
YAO CHONG (CN)
LI KE (CN)
XIAO NAN (CN)
LIU SUSHI (CN)
XU YONGZHE (CN)
MA CHIYUAN (CN)
LI SHIZHEN (CN)
YAO CHONG (CN)
Application Number:
PCT/CN2022/134588
Publication Date:
June 15, 2023
Filing Date:
November 28, 2022
Export Citation:
Assignee:
UNIV HARBIN SCIENCE & TECH (CN)
International Classes:
H01B13/00; H01B1/22; H05K7/20
Foreign References:
| CN114429829A | 2022-05-03 | |||
| JP2004047423A | 2004-02-12 | |||
| CN107112246A | 2017-08-29 | |||
| CN111146182A | 2020-05-12 |
Attorney, Agent or Firm:
HARBIN SUNSHINE HUIYUAN INTELLECTUAL PROPERTY AGENCY CO. LTD (CN)
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