Title:
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/017876
Kind Code:
A1
Abstract:
The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (PTFE) particles included in the substrate main body.
Inventors:
KINO TAKASHI (JP)
YOU DONGJOO (KR)
JOUNG JEAYOUL (KR)
LEE JUNSEOK (KR)
CHO SEONGMOON (KR)
LEE EUNGMIN (JP)
YOU DONGJOO (KR)
JOUNG JEAYOUL (KR)
LEE JUNSEOK (KR)
CHO SEONGMOON (KR)
LEE EUNGMIN (JP)
Application Number:
PCT/KR2021/010775
Publication Date:
February 16, 2023
Filing Date:
August 13, 2021
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
C08J5/18; B32B27/20; B32B27/28; C08L27/18; C08L79/08; C09J7/22; C09J179/08; H05K1/03
Domestic Patent References:
| WO2020022129A1 | 2020-01-30 |
Foreign References:
| KR20190055809A | 2019-05-23 | |||
| KR101503332B1 | 2015-03-18 | |||
| KR20130027442A | 2013-03-15 | |||
| KR20170134610A | 2017-12-06 |
Attorney, Agent or Firm:
KBK & ASSOCIATES (KR)
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