Title:
COMPOSITE RESIN COMPOSITION AND COMPOSITE RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/243281
Kind Code:
A1
Abstract:
This composite resin composition includes a main resin, a low-molecular-weight resin, a compatibilizing agent, and a filler. The low-molecular-weight resin is of the same type as the main resin. The molecular weight of the low-molecular-weight resin is lower than the molecular weight of the main resin. The compatibilizing agent has a molecular structure that is substantially the same as the molecular structure of the main resin.
Inventors:
HAMABE MASASHI
IMANISHI MASAYOSHI
NAGINO TOSHIFUMI
NISHINO SHOUMA
IMANISHI MASAYOSHI
NAGINO TOSHIFUMI
NISHINO SHOUMA
Application Number:
PCT/JP2023/018113
Publication Date:
December 21, 2023
Filing Date:
May 15, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; C08K7/02; C08L1/00; C08L23/00
Domestic Patent References:
| WO2022270167A1 | 2022-12-29 |
Foreign References:
| JP2020076082A | 2020-05-21 | |||
| JP2019147861A | 2019-09-05 | |||
| JP2018115254A | 2018-07-26 | |||
| JP2020122050A | 2020-08-13 | |||
| JP3167020B2 | 2001-05-14 | |||
| JP2021006604A | 2021-01-21 | |||
| JP2011236410A | 2011-11-24 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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