Title:
COMPOSITE SHEET FOR FORMING PROTECTIVE FILM, CHIP HAVING PROTECTIVE FILM, AND PRODUCTION METHOD FOR CHIP HAVING PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2015/016053
Kind Code:
A1
Abstract:
A composite sheet for forming a protective film, having: an adhesive sheet having a base material and an adhesive layer and including a cured area inside the adhesive layer; and a film for forming a protective film, which is directly laminated upon the cured area inside the adhesive layer. The adhesive layer comprises an adhesive composition including an energy ray-curable acrylic copolymer having an energy ray-polymerizable group introduced to an acrylic polymer (X) including a vinyl acetate-derived constituent unit (x1). The composite sheet for forming a protective film is capable of producing a chip having a protective film and having: a high suppression effect on the incursion of cutting fluid between the film for forming a protective film (protective film) and the adhesive layer when dicing a workpiece such as a wafer, etc.; excellent aptitude for pick up during chip production; and excellent visibility of a laser printing section on the protective film surface.
Inventors:
SAIKI NAOYA (JP)
YAMAMOTO DAISUKE (JP)
YONEYAMA HIROYUKI (JP)
TAKANO KEN (JP)
YAMAMOTO DAISUKE (JP)
YONEYAMA HIROYUKI (JP)
TAKANO KEN (JP)
Application Number:
PCT/JP2014/068731
Publication Date:
February 05, 2015
Filing Date:
July 14, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/22; C09J7/38; C09J131/04; C09J133/00; H01L21/301; H01L23/29; H01L23/31
Domestic Patent References:
| WO2013047674A1 | 2013-04-04 | |||
| WO2013099869A1 | 2013-07-04 |
Foreign References:
| JP2011228451A | 2011-11-10 | |||
| JP2005281419A | 2005-10-13 | |||
| JP2013098408A | 2013-05-20 | |||
| JP2002097436A | 2002-04-02 | |||
| JP2014120624A | 2014-06-30 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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