Title:
COMPOSITE SUBSTRATE AND METHOD FOR ESTIMATING THICKNESS TREND OF PIEZOELECTRIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/047605
Kind Code:
A1
Abstract:
A composite substrate of the present invention is a composite substrate provided with a support substrate having a diameter of 2 inches or more, and a piezoelectric substrate bonded to the support substrate, the piezoelectric substrate having a thickness of not more than 20 μm and transmitting light, wherein the piezoelectric substrate has a banded thickness distribution, the thickness distribution of the piezoelectric substrate having, in a cross section of the composite substrate taken along a line perpendicular to the bands, a waveform with an amplitude in the thickness direction of not less than 5 nm and not more than 100 nm, and with a pitch in a width direction of not less than 0.5 mm and not more than 20 mm, wherein the pitch of the waveform has a correlation with the width of the bands. In the piezoelectric substrate, the bands may be parallel bands, spiral bands, or concentric bands.
Inventors:
NAGAE TOMOKI (JP)
KOIZUMI AYATO (JP)
KOIZUMI AYATO (JP)
Application Number:
PCT/JP2016/077033
Publication Date:
March 23, 2017
Filing Date:
September 14, 2016
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L41/337; H01L41/053; H01L41/08; H01L41/313; H03H3/08; H03H9/25
Domestic Patent References:
| WO2014104098A1 | 2014-07-03 |
Foreign References:
| JP2015050653A | 2015-03-16 | |||
| JP2002079457A | 2002-03-19 | |||
| JP2002190629A | 2002-07-05 | |||
| JP2012185132A | 2012-09-27 | |||
| JP2001110788A | 2001-04-20 | |||
| JP2013197553A | 2013-09-30 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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