Title:
COMPOSITE SUBSTRATE, PIEZOELECTRIC ELEMENT, AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/027075
Kind Code:
A1
Abstract:
A composite substrate according to the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are bonded to each other directly, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in a bonded surface region including a bonded surface between the piezoelectric substrate and the sapphire substrate is less than 1.5. A piezoelectric element according to the present disclosure is equipped with the composite substrate. A method or manufacturing a composite substrate according to the present disclosure comprises the steps of: providing a piezoelectric substrate and a sapphire substrate; subjecting the sapphire substrate to a heat treatment in a reducing atmosphere or under vacuum; and directly bonding the piezoelectric substrate to the sapphire substrate.
Inventors:
UMEHARA MOTOHIRO (JP)
MITSUDA KUNIAKI (JP)
MITSUDA KUNIAKI (JP)
Application Number:
PCT/JP2019/029720
Publication Date:
February 06, 2020
Filing Date:
July 29, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C30B33/06; C30B29/16; C30B29/18; C30B29/30; H01L41/312; H03H3/08; H03H9/25
Domestic Patent References:
| WO2017134980A1 | 2017-08-10 |
Foreign References:
| JP2004343359A | 2004-12-02 | |||
| JP2017200101A | 2017-11-02 | |||
| JP2017200101A | 2017-11-02 | |||
| JP2016225538A | 2016-12-28 | |||
| JP2008301066A | 2008-12-11 |
Other References:
See also references of EP 3831988A4
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
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