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Patent Searching and Data


Title:
COMPOSITION FOR ADHESION OF DISSIMILAR MATERIALS, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/018212
Kind Code:
A1
Abstract:
The present invention relates to a composition for adhesion of dissimilar materials, and a preparation method therefor, and, more specifically, to a composition for adhesion of dissimilar materials, and a preparation method therefor, the composition comprising, in a specific weight ratio, a (meth)acrylic monomer, an epoxy resin, an epoxy curing accelerator, a thermal polymerization initiator, a polymerization inhibitor and a (meth)acrylic-modified polyurethane component, which comprises a hydrophilic (meth)acrylic-modified polyurethane and a lipophilic (meth)acrylic-modified polyurethane, and having excellent oil resistance while enabling high adhesiveness to be implemented between dissimilar materials at room temperature and high temperatures.

Inventors:
LEE JAE HOON (KR)
RYU HOON (KR)
IM JUN SEOP (KR)
Application Number:
PCT/KR2022/011907
Publication Date:
February 16, 2023
Filing Date:
August 10, 2022
Export Citation:
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Assignee:
SAMYANG CORP (KR)
International Classes:
C09J175/14; C09J7/28; C09J7/29; C09J7/35; C09J7/38; C09J133/04; C09J163/00
Foreign References:
JPS6490266A1989-04-06
KR20180102216A2018-09-14
KR102276178B12021-07-13
JPH0386703A1991-04-11
KR20210052697A2021-05-11
KR101079518B12011-11-03
KR20120066904A2012-06-25
KR20170125328A2017-11-14
Attorney, Agent or Firm:
HANSUNG INTELLECTUAL PROPERTY (KR)
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