Title:
COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/168833
Kind Code:
A1
Abstract:
Disclosed in the present application are a composition, an adhesive film comprising the composition, and a chip packaging structure. The composition comprises epoxy resin, a surfactant, a curing agent and a filler, the surfactant being selected from modified hexafluoropropylene compounds. The composition has relatively high coating wettability and relatively strong chemical washing resistance and can easily adhere to a release film. A chip protective film prepared from the composition has relatively strong washing resistance to an alkaline solution and thus is not liable to fall off.
Inventors:
WU DE (CN)
LIAO SHUHANG (CN)
LI TING (CN)
SU JUNXING (CN)
LIAO SHUHANG (CN)
LI TING (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2022/095569
Publication Date:
September 14, 2023
Filing Date:
May 27, 2022
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J163/00; C09J7/30; C09J11/08; C09J163/02; H01L23/29
Foreign References:
| CN114292615A | 2022-04-08 | |||
| CN111492006A | 2020-08-04 | |||
| JP2003105207A | 2003-04-09 | |||
| CN109476897A | 2019-03-15 | |||
| CN113292957A | 2021-08-24 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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