Title:
COMPOSITION FOR ADHESIVE, FILM-LIKE ADHESIVE, AND SEMICONDUCTOR PACKAGE IN WHICH FILM-LIKE ADHESIVE IS USED AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/024510
Kind Code:
A1
Abstract:
The present invention provides: a composition for an adhesive, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), the phenoxy resin (C) having an elastic modulus at 25°C of 500 MPa or above, the proportion occupied by the phenoxy resin (C) in the total contained amount of the epoxy resin (A) and the phenoxy resin (C) being 10-60 mass%, and an uncured film-like adhesive formed using the composition for an adhesive having a nanoindentation hardness at 25°C of 100 MPa or above and a Young's modulus of 100 MPa or above; a film-like adhesive in which the composition for an adhesive is used; and a semiconductor package in which the film-like adhesive is used and a method for manufacturing the same.
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Inventors:
MORITA MINORU (JP)
Application Number:
PCT/JP2021/018947
Publication Date:
February 03, 2022
Filing Date:
May 19, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J11/04; C09J7/30; C09J163/00; C09J171/00; H01L21/301; H01L21/52
Domestic Patent References:
| WO2017168820A1 | 2017-10-05 | |||
| WO2013161864A1 | 2013-10-31 |
Foreign References:
| JP2018188540A | 2018-11-29 | |||
| JP2017183642A | 2017-10-05 | |||
| JP2017179055A | 2017-10-05 | |||
| JP2012049388A | 2012-03-08 | |||
| JP2009167372A | 2009-07-30 | |||
| JP2020061423A | 2020-04-16 | |||
| JP2018182276A | 2018-11-15 | |||
| JP2016065209A | 2016-04-28 | |||
| JP2008124141A | 2008-05-29 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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