Title:
COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048271
Kind Code:
A1
Abstract:
Provided are: a composition for chemical mechanical polishing; and a polishing method using the same. The composition allows rapid polishing of a polishing surface that contains a silver material for wiring, and makes it possible to obtain a polished surface having a high reflective property. This composition for chemical mechanical polishing comprises (A) abrasive grains, (B) a liquid medium, (C) an oxidizing agent, and (D) a nitrogen-containing hetrocyclic compound. The absolute value of the zeta potential of the (A) component of the composition for chemical mechanical polishing is 10 mV or more. When the content of the (C) component is noted as Mc (mass%) and the content of the (D) component is noted as Md (mass%), Mc/Md is 10 to 200.
Inventors:
YAMADA YUYA (JP)
KAO SHEN-YUAN (JP)
KAO SHEN-YUAN (JP)
Application Number:
PCT/JP2023/029521
Publication Date:
March 07, 2024
Filing Date:
August 15, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2014175393A1 | 2014-10-30 |
Foreign References:
| JP2014069260A | 2014-04-21 | |||
| JP2008300858A | 2008-12-11 | |||
| JP2006519490A | 2006-08-24 | |||
| JP5760317B2 | 2015-08-05 |
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
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