Title:
COMPOSITION, CURED PRODUCT, STACKED BODY, PRODUCTION METHOD FOR UNDERLAYER FILM, PATTERN FORMATION METHOD, PATTERN, AND PRODUCTION METHOD FOR SEMICONDUCTOR RESIST
Document Type and Number:
WIPO Patent Application WO/2014/157228
Kind Code:
A1
Abstract:
Provided is a composition with which an underlayer film can be provided, said underlayer film exhibiting excellent adhesive properties between an imprint layer and a substrate, excellent in-plane uniformity with respect to film thickness, and a low defect density. This composition includes a polymerizable compound, a first solvent, and a second solvent. The boiling point of the first solvent at 1 atmosphere is at least 160˚C. The boiling point of the second solvent at 1 atmosphere is less than 160˚C. The content of the polymerizable compound in the composition is less than 1 mass%.
Inventors:
ENOMOTO YUICHIRO (JP)
KITAGAWA HIROTAKA (JP)
OOMATSU TADASHI (JP)
GOTO YUICHIRO (JP)
KITAGAWA HIROTAKA (JP)
OOMATSU TADASHI (JP)
GOTO YUICHIRO (JP)
Application Number:
PCT/JP2014/058326
Publication Date:
October 02, 2014
Filing Date:
March 25, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F299/02; C08F22/10; H01L21/027
Domestic Patent References:
| WO2012133148A1 | 2012-10-04 |
Foreign References:
| JP2012163735A | 2012-08-30 | |||
| JP2009503139A | 2009-01-29 | |||
| JP2009223293A | 2009-10-01 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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