Title:
COMPOSITION AND FILLER MIXTURE
Document Type and Number:
WIPO Patent Application WO/2023/013441
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a composition or a filler mixture. The composition includes a thermally conductive filler (A) having a particle size (D50 (A)) at 50% cumulative volume of 0.05 μm to less than 1.0 μm and a particle size (D90 (A)) at 90% cumulative volume of 2.0 μm or less in a particle size distribution curve by a laser diffraction method, a thermally conductive filler (B), and a binder component (C), and satisfies the following requirements (1)-(3). Requirement (1): the cumulative pore volume of pores having a diameter of 0.5 μm or less calculated from the pore diameter distribution measured by a mercury porosimeter of the entire thermally conductive filler (B) used in the composition is 0.05 mL/g or less. Requirement (2): the particle size (D50 (B)) at 50% cumulative volume of the entire thermally conductive filler (B) used in the composition is 1.0-100 μm. Requirement (3): the particle size (D10 (B)) at 10% cumulative volume of the entire thermally conductive filler (B) used in the composition is 0.6 μm or more.
Inventors:
FUJII SAIKO (JP)
SAKAMOTO ATSUSHI (JP)
MASADA ISAO (JP)
SAKAMOTO ATSUSHI (JP)
MASADA ISAO (JP)
Application Number:
PCT/JP2022/028465
Publication Date:
February 09, 2023
Filing Date:
July 22, 2022
Export Citation:
Assignee:
TOKUYAMA CORP (JP)
International Classes:
C08L101/00; C01B21/072; C01F7/02; C08K3/01; C08K3/22; C08K3/28; C09K5/14
Domestic Patent References:
| WO2020241716A1 | 2020-12-03 | |||
| WO2020138335A1 | 2020-07-02 | |||
| WO2018131486A1 | 2018-07-19 |
Foreign References:
| JP2018082164A | 2018-05-24 | |||
| JP2012121793A | 2012-06-28 | |||
| JP2013049610A | 2013-03-14 | |||
| JP2017014445A | 2017-01-19 | |||
| JP2010007039A | 2010-01-14 | |||
| JP2009164093A | 2009-07-23 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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