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Title:
COMPOSITION FOR FILM ADHESIVES, METHOD FOR PRODUCING SAME, FILM ADHESIVE, SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING FILM ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2013/161864
Kind Code:
A1
Abstract:
A method for producing a composition for film adhesives, said composition having an elastic modulus of 20-3,000 MPa at 200°C after thermal curing and a saturation water absorption of 1.5% by mass or less after thermal curing, and containing (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a phenoxy resin and (D) surface-treated spherical silica fillers which are obtained by surface-treating spherical silica fillers that have an average particle diameter of 0.01-2.0 μm with a silane coupling agent, with the content of the surface-treated spherical silica fillers (D) being 30-70% by mass relative to the total amount of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C) and the surface-treated spherical silica fillers (D). This method for producing a composition for film adhesives is characterized by comprising: a step for obtaining a surface-treated spherical silica filler dispersion by dispersing the surface-treated spherical silica fillers (D) in an organic solvent; and a step for obtaining a composition for film adhesives by mixing the epoxy resin (A), the epoxy resin curing agent (B) and the phenoxy resin (C) into the surface-treated spherical silica filler dispersion.

Inventors:
MORITA MINORU (JP)
YANO HIROYUKI (JP)
OHIRA SHINJI (JP)
Application Number:
PCT/JP2013/062030
Publication Date:
October 31, 2013
Filing Date:
April 24, 2013
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
C09J163/00; C09J7/00; C09J11/04; C09J11/06; C09J171/10; H01L21/52
Foreign References:
JP2010168470A2010-08-05
JP2009041019A2009-02-26
JP2011054707A2011-03-17
JP2011233633A2011-11-17
Attorney, Agent or Firm:
CENTCREST IP ATTORNEYS (JP)
Patent business corporation cent Crest international patent firm (JP)
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