Title:
COMPOSITION FOR FORMING ALKOXY GROUP-CONTAINING RESIST UNDERLAYER FILM
Document Type and Number:
WIPO Patent Application WO/2023/085295
Kind Code:
A1
Abstract:
A composition for forming a resist underlayer film for use in EB or EUV lithography, the composition containing a film-forming component and a solvent, the film-forming component containing at least 20 mass% of a specific structure-containing component containing at least a first structure including an aromatic ring or a second structure including a nitrogen atom, the first structure containing a group represented by formula (1) directly bonded to the aromatic ring, and the second structure containing a group represented by formula (1) directly bonded to the nitrogen atom. (In formula (1), R1 represents an alkylene group having 1-6 carbon atoms, and R2 represents a hydrogen atom, an alkyl group having 1-6 carbon atoms or an alkoxyalkyl group having a total of 2-10 carbon atoms. The symbol * represents a bond.)
Inventors:
OGATA HIROTO (JP)
TAMURA MAMORU (JP)
TAMURA MAMORU (JP)
Application Number:
PCT/JP2022/041632
Publication Date:
May 19, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C08G59/26; C08G59/40; G03F7/004; H01L21/027
Domestic Patent References:
| WO2021201167A1 | 2021-10-07 | |||
| WO2022107759A1 | 2022-05-27 |
Foreign References:
| JP2019082681A | 2019-05-30 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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