Title:
COMPOSITION FOR FORMING ELECTROLESS PLATING UNDERLAYER FILM
Document Type and Number:
WIPO Patent Application WO/2014/192287
Kind Code:
A1
Abstract:
A composition for forming an electroless plating underlayer film, which comprises an electrically conductive polymer and a polyvinyl acetal resin.
Inventors:
ARAI NAOKO (JP)
NAKAMURA MITSUTAKE (JP)
ONODERA SHINGO (JP)
FUKATSU FUMIOKI (JP)
NAKAMURA MITSUTAKE (JP)
ONODERA SHINGO (JP)
FUKATSU FUMIOKI (JP)
Application Number:
PCT/JP2014/002782
Publication Date:
December 04, 2014
Filing Date:
May 27, 2014
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C23C18/20; C09D5/00; C09D129/14; C09D175/04; C09D179/00
Domestic Patent References:
| WO2013031846A1 | 2013-03-07 |
Foreign References:
| JPH0143025B2 | 1989-09-18 | |||
| JP2809714B2 | 1998-10-15 | |||
| JP2012062462A | 2012-03-29 |
Attorney, Agent or Firm:
WATANABE, Kihei et al. (JP)
Kihei Watanabe (JP)
Kihei Watanabe (JP)
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