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Title:
COMPOSITION FOR FORMING GAP-FILLING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/048487
Kind Code:
A1
Abstract:
A composition for forming a gap-filling material, the composition comprising: a compound and/or a polymer each having a structure represented by formula (1) and a carbonyl bond; and a solvent. (In formula (1), R1 and R2 each independently represent a hydrogen atom, a cyano group, a phenyl group, a C1-C13 alkyl group, a halogen atom, -COOR11 (R11 represents a hydrogen atom or a C1-C4 alkyl group), or -COO-; when there are two or more R3 moieties, then the two or more R3 moieties may be the same or different; R3 represents a methoxy group, a C1-C13 alkyl group, or a halogen atom; n1 is an integer of 0-4 and n2 is an integer of 0 or 1, the sum of n1 and n2 being 4 or less; X1 represents an ether bond or an ester bond; X2 represents an ether bond or an ester bond; and * indicates a bond.)

Inventors:
KISHIOKA TAKAHIRO (JP)
KUBODERA SHUN (JP)
KAMIBAYASHI SATOSHI (JP)
Application Number:
PCT/JP2023/030868
Publication Date:
March 07, 2024
Filing Date:
August 28, 2023
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
H01L21/768; C08G59/24; C08G59/26; G03F7/11; H01L23/12
Domestic Patent References:
WO2020255984A12020-12-24
WO2009008446A12009-01-15
WO2015098525A12015-07-02
Foreign References:
JP2011528186A2011-11-10
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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