Title:
COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER
Document Type and Number:
WIPO Patent Application WO/2021/020081
Kind Code:
A1
Abstract:
The present invention provides a composition, for forming a heat-conducting material, which can provide a heat-conducting material with excellent heat-conducting characteristics. Provided are a heat-conducting material, a heat-conducting sheet, and a device with a heat-conducting layer that are formed via the composition for forming the heat-conducting material. The composition, for forming a heat-conducting material, of the present invention is a composition, for forming a heat-conducting material, that includes a phenol compound, an epoxy compound, and an inorganic substance, wherein the phenol compound includes 50 wt.% or more of a specific phenol compound that satisfies requirement 1 and requirement 2 with respect to the total weight of the phenol compound, and the epoxy compound includes a multifunctional epoxy compound having three or more epoxy groups. Requirement 1: The molecular weight of the specific phenol compound is 400 or less. Requirement 2: The specific temperature of the specific phenol compound is 240°C or less. Note that the specific temperature means the melting point of a substance for substances having a melting point, and means the softening point of the substance for substances which do not have a melting point.
Inventors:
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
NIORI TERUKI (JP)
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2020/027057
Publication Date:
February 04, 2021
Filing Date:
July 10, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L63/00; C08G59/32; C08G59/62; C08K3/28; C08K5/13; C09K5/14; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2012133587A1 | 2012-10-04 | |||
| WO2019013343A1 | 2019-01-17 | |||
| WO2012070402A1 | 2012-05-31 |
Foreign References:
| JP2016104862A | 2016-06-09 | |||
| JP2001055425A | 2001-02-27 | |||
| JP2012017405A | 2012-01-26 | |||
| JP2007197518A | 2007-08-09 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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