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Title:
COMPOSITION FOR FORMING LOW DIELECTRIC CONSTANT RESIN, LOW DIELECTRIC MEMBER, AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/092063
Kind Code:
A1
Abstract:
The purpose of the present invention is to achieve a composition for forming a low dielectric constant resin which is suitable for use in a substrate for radar, next-generation communication devices and the like using higher frequencies, while having high heat dissipation properties.　The present invention enables the achievement of a polymerizable composition, which is able to be molded by a solution process, while exhibiting thermal conductivity and low dielectric properties lower than those of conventional liquid crystal polymers, by curing a polymerizable polycyclic compound that has less conjugates or polar groups, while exhibiting higher linearity or symmetry of each molecule.

Inventors:
FUJIWARA TAKESHI (JP)
SAGO KOKI (JP)
Application Number:
PCT/JP2021/039430
Publication Date:
May 05, 2022
Filing Date:
October 26, 2021
Export Citation:
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Assignee:
JNC CORP (JP)
International Classes:
C08F20/20; C08F20/26; C08G59/50; H01B3/30
Domestic Patent References:
WO2020045560A12020-03-05
WO2015170744A12015-11-12
Foreign References:
JP2006265527A2006-10-05
JP2020500981A2020-01-16
JP2013509458A2013-03-14
JP2019214724A2019-12-19
JP2019189734A2019-10-31
JP2009067894A2009-04-02
JP2006265527A2006-10-05
JP2004256687A2004-09-16
JP2002226550A2002-08-14
JP5084148B22012-11-28
Other References:
J. AM. CHEM. SOC., vol. 123, 2001, pages 5414
P. KIRSCH ET AL., ANGEW. CHEM. INT. ED., vol. 40, 2001, pages 1480
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